Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidemüller, Jens; Dogan, Özgü; Utz, Alexander; Goertz, M.:
3D Packaging Technologies for Smart Medical Implants
In: Smartsystems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Cork, Ireland, 8-9 March 2017 / Otto, Thomas (Hrsg.). - International Conference and Exhibition on Integration Issues of Miniaturized Systems; Cork, Ireland; 08.03.-09.03.2017 - Auerbach /V.: Verlag Wissenschaftliche Scripten, 2017, S. 41 - 47
2017Aufsatz (Konferenz) in Tagungsband
Fakultät für Informations-, Medien- und Elektrotechnik » Institut für Angewandte Optik und Elektronik
Damit verbunden: 1 Publikation(en)
Titel:
3D Packaging Technologies for Smart Medical Implants
Autor*in:
Schröder, Tim;Wünsch, Dirk;Baum, Mario;Hiller, Karla;Wiemer, Maik;Otto, Thomas;Weidemüller, Jens;Dogan, Özgü;Utz, AlexanderTH Köln
DHSB-ID
THK0067439
ORCID
0000-0002-1274-4563ORCID iD
SCOPUS
41961590500
Sonstiges
der TH Köln zugeordnete Person
;Goertz, M.
Erscheinungsjahr:
2017
Sprache des Textes:
Englisch
Erschienen in
Smartsystems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Cork, Ireland, 8-9 March 2017
Konferenz
International Conference and Exhibition on Integration Issues of Miniaturized Systems; Cork, Ireland; 08.03.-09.03.2017
Herausgeber*in:
Otto, Thomas
Erscheinungsort:
Auerbach /V.
Verlag:
Verlag Wissenschaftliche Scripten
Erscheinungsjahr:
2017
in:
S. 41 - 47
ISBN
978-3-95735-057-2
Ressourcentyp:
Text
Access Rights:
nur Zugriff auf Metadaten
Peer Reviewed:
Peer Reviewed
Praxispartner*in:
Nein
Kategorie:
Forschung
Teil der Statistik:
Nicht Teil der Statistik

Abstract:

In this study, the packaging for an implantable hemodynamic control system is developed and implemented. The system contains sensor elements to measure pressure, acceleration, temperature, voltage and impedance. Furthermore, the system has an inductive link for energy and data transmission. All components are fitted on an LTCC multilayer interposer, which not only connects all components, but also provides a coil for the inductive link. This work focuses on the 3D interconnects of a MEMS acceleration sensor, the integration of all components on the interposer as well as the encapsulation.