Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidemüller, Jens; Dogan, Özgü; Utz, Alexander; Goertz, M.:
3D Packaging Technologies for Smart Medical Implants
In: Smartsystems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Cork, Ireland, 8-9 March 2017 / Otto, Thomas (Eds.). - International Conference and Exhibition on Integration Issues of Miniaturized Systems; Cork, Ireland; 08.03.-09.03.2017 - Auerbach /V.: Verlag Wissenschaftliche Scripten, 2017, pp. 41 - 47
2017Essay (Conference) in Conference proceedings
Faculty of Information, Media and Electrical Engineering » Institute of Applied Optics and Electronics
Related: 1 publication(s)
Title:
3D Packaging Technologies for Smart Medical Implants
Author:
Schröder, Tim;Wünsch, Dirk;Baum, Mario;Hiller, Karla;Wiemer, Maik;Otto, Thomas;Weidemüller, Jens;Dogan, Özgü;Utz, AlexanderTH Köln
DHSB-ID
THK0067439
ORCID
0000-0002-1274-4563ORCID iD
SCOPUS
41961590500
Other
person connected with TH Köln
;Goertz, M.
Year of publication:
2017
Language of text:
English
Appears in
Smartsystems Integration 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Cork, Ireland, 8-9 March 2017
Conference
International Conference and Exhibition on Integration Issues of Miniaturized Systems; Cork, Ireland; 08.03.-09.03.2017
Editor:
Otto, Thomas
Place of publication:
Auerbach /V.
Publisher:
Verlag Wissenschaftliche Scripten
Year of publication:
2017
in:
pp. 41 - 47
ISBN
978-3-95735-057-2
Type of resource:
Text
Access Rights:
metadata only access
Peer Reviewed:
Peer Reviewed
Practice Partner:
No
Category:
Research
Part of statistic:
Not part of statistic

Abstract:

In this study, the packaging for an implantable hemodynamic control system is developed and implemented. The system contains sensor elements to measure pressure, acceleration, temperature, voltage and impedance. Furthermore, the system has an inductive link for energy and data transmission. All components are fitted on an LTCC multilayer interposer, which not only connects all components, but also provides a coil for the inductive link. This work focuses on the 3D interconnects of a MEMS acceleration sensor, the integration of all components on the interposer as well as the encapsulation.