Schmid, André; Modrow, Niklas; Humpert, Christof:
Breakdown Strength and Dielectric Properties of Stereolithography 3D-Printed Dielectrics for High Voltage Applications
In: 23rd International Symposium on High Voltage Engineering (ISH 2023) / IET (Eds.). - ISH 2023, 23rd International Symposium on High Voltage Engineering; Glasgow, Scotland; 28.08-01.09.2023 - 2023, pp. 1242 - 1248
2023Essay (Conference) in Conference proceedings
Faculty of Information, Media and Electrical Engineering » Institute of Electrical Power Engineering
Related: 1 publication(s)
Title in English:
Breakdown Strength and Dielectric Properties of Stereolithography 3D-Printed Dielectrics for High Voltage Applications
Author:
Schmid, AndréTH Köln
DHSB-ID
THK0003463
ORCID
0000-0002-1746-5803ORCID iD
SCOPUS
57191572179
Other
person connected with TH Köln
;Modrow, Niklas
SCOPUS
59317275200
;Humpert, ChristofTH Köln
DHSB-ID
THK0001727
ORCID
0000-0002-2289-3570ORCID iD
SCOPUS
20433570700
Other
person connected with TH Köln
corresponding author
Year of publication:
2023
DOI
10.1049/icp.2024.0794
Scopus ID
85203324198
WWW URL:
https://digital-library.theiet.org/content/conferences/10.1049/icp.2024.0794
Language of text:
English
Appears in
23rd International Symposium on High Voltage Engineering (ISH 2023)
Conference
ISH 2023, 23rd International Symposium on High Voltage Engineering; Glasgow, Scotland; 28.08-01.09.2023
Editor:
IET
Year of publication:
2023
in:
pp. 1242 - 1248
ISBN
978-1-83953-992-3
Language of text:
English
Type of resource:
Text
Practice Partner:
No
Category:
Research
Part of statistic:
Not part of statistic
Type of resource:
Text
Practice Partner:
No
Category:
Research
Part of statistic:
Part of statistic